Bga Reballing Service

SKU: ET-SERVIZI REBALLING

In stock: 10

Product Categories: BGA Rework & Services

Product Page: https://etneo.com/prodotto/bga-reballing-service/?lang=en

Product Summary

Bga Reballing Service

Product Description

Etneo Italia offers an advanced Service of pcb Rework and component reballing.

Spheres Deballing - Cleaning Pads - Ball grid arrays reballing at low temperature by Laser process-Visual Inspection - Components back on tape reel or trays under vacuum packaged - One full day of component baking to eliminate moisture and contaminations.

Product Attributes

• Dimensions: N/A
• Weight: 3 kg