Bga Reballing Service
Product description
Etneo Italia offers an advanced Service of pcb Rework and component reballing.
Spheres Deballing – Cleaning Pads – Ball grid arrays reballing at low temperature by Laser process-Visual Inspection – Components back on tape reel or trays under vacuum packaged – One full day of component baking to eliminate moisture and contaminations.
Additional info
| Weight | 3 kg |
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