Bga Reballing Service

Bga Reballing Service

SKU: ET-SERVIZI REBALLING Category:
   

Product description

Etneo Italia offers an advanced Service of pcb Rework and component reballing.

Spheres Deballing – Cleaning Pads – Ball grid arrays reballing at low temperature by Laser process-Visual Inspection – Components back on tape reel or trays under vacuum packaged – One full day of component baking to eliminate moisture and contaminations.

Additional info

Weight 3 kg

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